EuroSOI-ULIS 2026
欧洲SOI-ULIS 2026国际会议前瞻
欧洲SOI-ULIS国际会议是专注于绝缘体上硅（SOI）技术和超低功耗集成电路（ULIS）领域的重要学术盛会。该会议汇集了全球顶尖的研究人员、工程师和产业界代表，旨在交流SOI技术的最新进展、超低功耗设计方法学以及相关应用。
根据行业信息，下一届会议（EuroSOI-ULIS 2026）的筹备工作已提上日程。预计会议将继续聚焦于SOI器件的物理与建模、先进制造工艺、面向物联网（IoT）、人工智能（AI）边缘计算和能效关键型应用的新型电路与系统设计等核心议题。会议通常包含特邀报告、技术论文宣讲、海报展示及专题讨论环节，为学术界与工业界提供深度交流与合作的平台。
该会议信息的发布，标志着相关领域的研究社区已开始规划2026年的学术交流活动，有助于研究人员提前布局相关研发工作与成果发表。
EuroSOI-ULIS 2026 Conference to be Held in Grenoble, France
The joint EuroSOI-ULIS 2026 international conference will take place in Grenoble, France, from March 23 to 26, 2026. This event merges two leading technical conferences: the European Conference on Silicon-On-Insulator Technology, Devices, and Circuits (EuroSOI) and the International Conference on Ultimate Integration on Silicon (ULIS).
The conference will focus on the latest advancements in silicon-on-insulator (SOI) technologies and ultra-scaled integration. Key topics will include emerging materials, novel device architectures, circuit design, and system-level applications for next-generation microelectronics. The event typically attracts researchers, engineers, and industry professionals from academia and the semiconductor sector worldwide.
Grenoble, a major European hub for microelectronics and nanotechnology research, will host the conference. The location underscores France's and the region's strategic role in advanced semiconductor innovation.
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