From 6/2/2026 to 6/5/2026Malaga, Spain
CEA-Leti will participate in EuCNC & 6G Summit 2026 through a broad portfolio of demonstrations, workshops, and scientific contributions showcasing its latest research and innovation in future communication systems. Through contributions to European and national collaborative projects, CEA-Leti will present advances in distributed MIMO, semantic communications, integrated sensing and communication (ISAC), AI-native networking, sustainability for 6G, and sub-THz technologies. Participants will discover concrete technology demonstrators and real-world use cases for Industry 4.0, intelligent sensing, robotics, and future wireless infrastructures, while gaining insights into emerging 6G architectures, energy-efficient networks, and the technologies shaping next-generation connectivity.
COME AND MEET CEA-LETI'S EXPERTS
This year, CEA-Leti will exhibit projects results in several booths.
6/4/2026, 11h00-12h30PHY4 - Sala 3
Francesca Costanzo (presenter)Tan-Tho LucBenoit Denis
DISAC Architecture: Functions, Semantics, Protocols, Orchestration, and Demonstrator
6/3/2026, 17h00-18h30PHY2 - Sala de Conferencias 2.1
Jean-Baptiste Doré (presenter),David DemmerBenoit Denis (CEA-Leti)
Opportunistic 3D Radar Positioning with MIMO-OFDM for ISAC
6/5/2026, 8h30-10h00PHY8 - Sala 3
Antony Pottier (presenter),Valérian MannoniJean-Baptiste Doré (CEA-Leti)
Block Turbo Equalization for ZP-OTFS in Fractional Delay-Doppler Channels
6/3/2026, 8h30-10h00WOS1 - Sala 5
Ala Eddine Nouali,Mattia Merluzzi (presenter)Jean-Baptiste Doré (CEA-Leti)Jean-Paul Jamont (Université Grenoble Alpes, France)
Dynamic Access Point Sleep Mode Optimization for Energy-Efficient Cell-Free MIMO Networks
6/3/2026, 17h00-18h30CMP2 - Sala 3
Antonio Clemente (presenter)J. L. Gonzalez-Jimenez (CEA-Leti)
Sub-THz programmable metasurfaces for ultra-high-rate wireless communications
6/4/2026, 16h30-18h00AI4C6 - Sala 4
Mattia MerluzziMateus Pontes Mota (CEA-Leti)
Semantic Communications with RIC-Centric AI-Driven Orchestration for 6G Networks
DIVE DEEPER INTO Sustainabiity, Semantic and Goal-oriented Communication, AI for 6G networks, DISAC and Metasurfaces Technologies.
CEA-Leti is involved in several dissemination events at the EuCNC & 6G Summit 2026, in the context of SNS JU European projects.
The 2026 EuCNC & 6G Summit builds on putting together two successful conferences in the area of telecommunications: EuCNC (European Conference on Networks and Communications), supported by the European Commission, and the 6G Summit, originated from the 6G Flagship programme in Finland, one of the very first in its area. The conference is sponsored by the IEEE Communications Society (ComSoc), the European Association for Signal Processing (EURASIP) and the European Association on Antennas and Propagation (EurAAP), and focuses on all aspects of telecommunications ranging from 5G deployment and mobile IoT to 6G exploration and future communications systems and networks, including experimentation and testbeds, and applications and services.
More information on EuCNC & 6G Summit website
6/2/2026 to 6/2/2026 |Malaga, Spain
Contacts:Francesca COSTANZOorRaffaele D'ERRICOwith any questions.
Event | Agenda|Y-Spot Partners, Grenoble, France
We are delighted to announce that CEA is hosting the "Organoids & Organoids-on-Chip" workshop at its Grenoble site on September 29, 2026.
Event|Maison Minatec, Grenoble, France
LID World Summit from 23 to 25 June offer you a front-row seat to our most recent advances. Join more than 1,250 semiconductor industry professionals at this three-day global event and come away equipped and inspired to innovate!
We’re excited to welcome you back to PCIM!
Join us to discover our latest innovations through live demonstrations, including:- Ultra thin power converter based on piezoelectric storage,- Smart multilevel converter utilizing flying capacitor topology- High Power multilevel GaN DCDC converter for fuel cell to battery voltages adaptation- Predictive maintenance on power electronic based on non invasive sensors.Focus will be put on CEA Wide Band Gap roadmap and technologies to address high demand and challenges on power supplies. It addresses different applications from data center to drones going through automotive, aeronautic, spatial, medical.
Event|Minatec, Grenoble, France
The workshop gathers scientists, engineers and industry partners to discuss advances and challenges in dry etching, plasma processing and related technologies for semiconductor, MEMS and emerging applications.
CEA-Leti experts will be onsite at booth 1 and available to discuss the findings of Six Papers and Posters Includes eco-innovation, microbumps, FO-WLP, packaging and hybrid bonding.