From 6/9/2026 to 6/11/2026Nuremberg, Germany
COME AND MEET CEA-LETI'S EXPERTS
This year, CEA-Leti’s booth will exhibit PowerGaN, Piezo DCDC Converter and Smart Predictive Maintenance demos. Come and discuss lastest achievements in terms of power electronics.
Efficient step-up power converter for fuel cell-batteries
An ultra-slim and lightweight converter for tomorrow's chargers
AI-assisted ultrasonic sensors for the predictive maintenance of power components
DISCOVER CEA-LETI’S MAJOR SCIENTIFIC RESULTS
The institute will present this year’s major scientific results at PCIM
June 11, 2026Poster sessionHall 4A, PP354
SiC MOSFET Gate Switching Stress with In-Situ Threshold Voltage Monitoring and Self-Heating Analysis
The PCIM Expo & Conference in Nuremberg, Germany is the leading international event for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management. It connects experts from industry and academia who are dedicated to driving forward products, research and development along the entire value chain. This has made the PCIM Expo & Conference an indispensable meeting place for the industry and the home of power electronics for decades.
More information on PCIM’s website
From 6/9/2026 to 6/11/2026 |Nuremberg, Germany
Contact:Philippe Despessewith any questions.
Event | Agenda|Y-Spot Partners, Grenoble, France
We are delighted to announce that CEA is hosting the "Organoids & Organoids-on-Chip" workshop at its Grenoble site on September 29, 2026.
Event|Maison Minatec, Grenoble, France
LID World Summit from 23 to 25 June offer you a front-row seat to our most recent advances. Join more than 1,250 semiconductor industry professionals at this three-day global event and come away equipped and inspired to innovate!
Event|Minatec, Grenoble, France
The workshop gathers scientists, engineers and industry partners to discuss advances and challenges in dry etching, plasma processing and related technologies for semiconductor, MEMS and emerging applications.
CEA-Leti experts will be onsite at booth 1 and available to discuss the findings of Six Papers and Posters Includes eco-innovation, microbumps, FO-WLP, packaging and hybrid bonding.
CEA-Leti will participate in EuCNC & 6G Summit 2026 through a broad portfolio of demonstrations, workshops, and scientific contributions showcasing its latest research and innovation in future communication systems. Through contributions to European and national collaborative projects, CEA-Leti will present advances in distributed MIMO, semantic communications, integrated sensing and communication (ISAC), AI-native networking, sustainability for 6G, and sub-THz technologies. Participants will discover concrete technology demonstrators and real-world use cases for Industry 4.0, intelligent sensing, robotics, and future wireless infrastructures, while gaining insights into emerging 6G architectures, energy-efficient networks, and the technologies shaping next-generation connectivity.