CEA-Leti发布其2026年科学报告,重点展示半导体技术突破

CEA-Leti Publishes Its 2026 Scientific Report Highlighting Breakthroughs in Semiconductor Technologies

CEA-Leti Original
摘要
CEA-Leti发布2026年科学报告,展示其在半导体领域的重大进展,并强调通过法国2030计划和欧盟芯片法案等合作项目(如PEPR、FAMES试点线)加速先进技术向产业转移。该机构与国际及欧洲领先研究组织加强协作,在FD-SOI、嵌入式内存和3D集成等关键技术取得突破,推动半导体创新从追求密度转向功能拓展。科学总监Thomas Ernst致谢全球合作伙伴,报告也凸显CEA-Leti入选全球百强创新者,巩固了其在技术主权和未来集成系统研发中的核心地位。

CEA-Leti 正式发布其《2026 年科学报告》,展示了 2025 年在半导体技术领域的一系列重大进展,并凸显该机构在国际创新生态中的核心地位。报告体现了其对法国 2030 计划、欧盟《芯片法案》等战略优先事项的支撑,通过 PEPR 研究计划及已运行两年的 FAMES 中试线等大型协作项目,正在产生切实成果并加速先进技术向产业转移。2025 年,CEA-Leti 与国际伙伴及欧洲研究技术组织(RTO)的合作更加紧密,在 FD-SOI、嵌入式存储器和先进 3D 集成等关键领域取得重要突破,这些技术对强化技术主权至关重要。

报告指出半导体创新正从追求密度缩放转向功能缩放:新材料、互连和器件架构的发展释放出全新物理特性,为集成系统带来前所未有的能力。前沿研究覆盖光子学、片上学习、能源管理、量子技术,以及空间、安全、医疗健康应用,并包含持续的生态创新方案。CEA 的研发实力近期获科睿唯安“全球百强创新机构”排名的认可。科学总监 Thomas Ernst 强调:“我要向全球所有合作伙伴,以及实验室、洁净室和支撑团队的专业人士致以最深切的感谢,他们的专业与奉献才使得这些激动人心的进步成为可能。”读者可通过下载报告深入了解相关技术布局及依托世界级预产业化设施所积累的专长。

Summary
CEA-Leti's 2026 Scientific Report highlights major semiconductor breakthroughs, including FD-SOI and advanced 3D integration, fueled by the FAMES Pilot Line and France 2030 under the EU Chips Act. Scientific Director Thomas Ernst underscores a strategic shift from density scaling to functionality, advancing fields like photonics and on-chip learning while reinforcing Europe’s technological sovereignty. These collaborative efforts, recognized by Clarivate’s Top 100 Global Innovators ranking, accelerate industrial technology transfer and eco-innovation.

CEA-Leti has published its 2026 Scientific Report, detailing a year of breakthroughs in semiconductor technologies and underscoring its pivotal role in the global innovation landscape. The work aligns with CEA’s strategic priorities across international, European, and national levels, including France 2030 programs and the EU Chips Act.

Key 2025 achievements stem from major collaborative projects such as the Priority Research Programs and Infrastructures (PEPR) and the FAMES Pilot Line, now in its second year. These initiatives are generating tangible results and speeding the transfer of advanced technologies to industry. Partnerships were vital: CEA-Leti intensified collaborations with global partners and European research and technology organizations, driving progress in FD-SOI, embedded memory, and advanced 3D integration—critical to technological sovereignty.

The report highlights a paradigm shift from scaling for density to scaling for functionality. Novel materials, interconnects, and device architectures are unlocking new physical properties and integrated system capabilities. Research spans photonics, on-chip learning, energy management, quantum technologies, and applications in space, security, healthcare, alongside eco-innovation.

CEA’s excellence was recognized with a spot among Clarivate’s Top 100 Global Innovators. Scientific Director Thomas Ernst thanked worldwide partners and the staff in labs, cleanrooms, and support roles, crediting their expertise for the advances. The full report is available for download, offering in-depth examples of how CEA-Leti leverages its pre-industrialization facilities to shape future technologies.

Résumé
Le CEA-Leti a publié son rapport scientifique 2026, mettant en avant des avancées majeures en technologies des semi-conducteurs grâce à des initiatives comme la ligne pilote FAMES et les PEPR, en phase avec France 2030 et l’EU Chips Act. L’institut, récemment classé parmi les 100 meilleurs innovateurs mondiaux par Clarivate, renforce ses partenariats internationaux pour accélérer le transfert vers l’industrie, notamment sur la FD-SOI, la mémoire embarquée et l’intégration 3D. Thomas Ernst, directeur scientifique, insiste sur l’importance de la collaboration pour soutenir la souveraineté technologique et une innovation qui privilégie désormais la fonctionnalité sur la seule densité.

​​​​​CEA-Leti has releases its 2026 Scientific Report, showcases a year of significant advances in semiconductor technologies and reaffirms its central role in International's innovation ecosystem. The report reflects the institute's commitment to supporting the CEA's strategic priorities at international, european and national level, notably through France 2030 programs and the EU Chips Act.

The results achieved in 2025 demonstrate the tangible impact of major collaborative initiatives, including the Priority Research Programs and Infrastructures (PEPR) and the FAMES Pilot Line, which has been operational for two years. These large-scale investments are already delivering promising outcomes and accelerating the transfer of advanced technologies to industry.

Strong partnerships were more crucial than ever in 2025. CEA-Leti strengthened its collaborations with intertnational partners, and leading European research and technology organizations (RTOs). These joint efforts have led to major progress in key domains such as FD-SOI, embedded memory, and advanced 3D integration, technologies that are essential to reinforcing technological sovereignty.

The report also highlights a broader shift in semiconductor innovation: moving from scaling for density to scaling for functionality. Advances in materials, interconnects, and device architectures are enabling new physical properties and unlocking unprecedented capabilities in integrated systems.

Readers will discover cutting-edge research across a wide range of fields, including photonics, on-chip learning, energy management, quantum technologies, and applications for space, security, and healthcare, as well as ongoing eco-innovation initiatives.

Finally, the report underscores the excellence of CEA's research, recently recognized by its ranking among the world's Top 100 Global Innovators by Clarivate.

Thomas Ernst, Scientific Director of CEA-Leti, highlights the importance of collaboration and collective commitment: « I would like to express my deepest gratitude to all our partners worldwide, and to the dedicated people in our labs, cleanrooms, and support functions whose expertise and dedication have made the exciting advances on the following pages possible. »

Download the 2026 Scientific Report to explore in-depth examples of this approach and discover how CEA-Leti continues to shape the future to deliver solid expertise, leveraging world-class pre-industrialization facilities.​

AI Insight
Core Point

CEA-Leti’s 2026 scientific report details semiconductor breakthroughs (FD-SOI, embedded memory, 3D integration, on-chip AI, quantum, photonics) that accelerate Europe’s technological sovereignty and advanced manufacturing under France 2030 and the EU Chips Act.

Key Players
  • CEA-Leti — French microelectronics research institute, Grenoble, driving pre-industrial semiconductor innovation and collaborative tech transfer.
Industry Impact
  • ICT: High — foundational semiconductor advances enabling next-gen connectivity and processing.
  • Computing/AI: High — on-chip learning and advanced integration boost AI hardware efficiency and capability.
  • Energy: Medium — energy management innovations featured in the report.
  • Terminals/Consumer Electronics: Medium — FD-SOI and 3D integration underpin smarter, more efficient devices.
Tracking

Strongly track — critical node for EU chip sovereignty, shaping global semiconductor roadmaps and unlocking strategic autonomy.

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Categories
半导体 科研
AI Processing
2026-04-30 12:46
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