Toshiba, Rohm et Mitsubishi veulent créer un géant des semi-conducteurs de puissance
日本三大工业巨头东芝、罗姆和三菱电机正计划整合其功率半导体业务，以打造行业新巨头。三方已签署谅解备忘录，正式启动相关合并谈判。
功率半导体是高效电能转换与管理的关键元件，广泛应用于电动汽车、可再生能源及工业设备领域。面对全球市场激烈竞争，尤其是来自中国企业的压力，日本企业正寻求通过整合资源强化竞争力。
根据协议，三家公司计划将旗下功率半导体设计、制造及模块业务合并至一家新公司。东芝和三菱电机将把相关业务分拆注入，而罗姆则考虑通过注资或业务转移方式参与。合并后实体预计年销售额将超过2000亿日元（约合13亿美元），成为日本功率半导体市场的领导者。
此次整合旨在通过规模效应和技术互补，提升研发与生产能力。东芝在绝缘栅双极型晶体管（IGBT）领域实力雄厚，罗姆擅长碳化硅（SiC）功率器件，三菱电机则在铁路牵引等大功率应用方面经验丰富。合并将帮助日本企业更有效地应对全球供应链重组和技术迭代挑战。
该交易仍需经过尽职调查、最终协议签署及反垄断审查，预计于2025年3月底前完成。若成功实施，将显著改变日本乃至全球功率半导体产业格局。
Three major Japanese industrial groups—Toshiba, Rohm, and Mitsubishi Electric—have signed a memorandum of understanding to begin formal discussions on merging their power semiconductor and module businesses. The move aims to create a new industry leader to compete more effectively in the rapidly growing global market for power devices, essential for electric vehicles, renewable energy, and industrial automation.
The proposed joint venture would consolidate Toshiba's and Mitsubishi Electric's respective power device divisions with Rohm's subsidiary, Rohm Semiconductor. The new entity would be majority-owned by Rohm, holding a 50.1% stake, while Toshiba would own 25% and Mitsubishi Electric 24.9%. This structure positions Rohm as the controlling partner in the integrated operation.
The companies cite the need for "strengthening international competitiveness" and achieving "sustainable growth" as core motivations. By pooling R&D resources, manufacturing capabilities, and customer bases, the alliance seeks to accelerate development of next-generation silicon carbide (SiC) power semiconductors—a key technology offering greater efficiency and performance. The merger is also a strategic response to intense global competition, particularly from Chinese and European players heavily investing in the sector.
Final agreements are expected by October 2024, following due diligence and regulatory approvals. The deal reflects a broader consolidation trend in the global semiconductor industry, as firms combine scale and expertise to meet soaring demand and technological challenges.
Dans un communiqué commun, les trois groupes japonais ont annoncé la signature d’un protocole d’accord marquant l’officialisation des discussions concernant la fusion de leurs activités respectives en semi-conducteurs et modules de puissance. Vendredi, les groupes japonais Toshiba, Rohm et Mitsubishi Electric ont annoncé, par le biais d’un communiqué commun, la signature d’un protocole d’accord visant […]
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Toshiba, Rohm, and Mitsubishi Electric have signed an MoU to discuss merging their power semiconductor and power module businesses, a move that could create a major Japanese supplier in a strategic chip segment.
Toshiba — diversified industrial and electronics group, based in Japan.
Rohm — semiconductor maker specializing in power and analog chips, based in Japan.
Mitsubishi Electric — industrial electronics and automation company, based in Japan.
Monitor — early-stage consolidation in a strategic chip niche could reshape supply chains, but the deal is not finalized.