Avec NextGen, le CEA invente les futures générations de puces électroniques pour maintenir la compétitivité française
法国原子能与替代能源委员会（CEA）近日启动"NextGen"项目，旨在设计新一代FD-SOI（全耗尽型绝缘体上硅）芯片。该项目聚焦开发能效更高、能耗更低的芯片技术，以掌握尖端元器件制造能力，确保法国及欧洲微电子产业在未来市场保持竞争力。
FD-SOI技术通过在硅基板中嵌入绝缘层，能显著降低晶体管漏电流，提升芯片性能与能效比。NextGen项目将推动该技术向更小制程节点演进，应对物联网、自动驾驶、人工智能等新兴领域对低功耗、高性能芯片的迫切需求。
这一战略举措旨在强化欧洲半导体供应链的自主性，减少对外部技术依赖。通过产学研协同创新，CEE计划在2026年前完成新一代FD-SOI技术的原型验证，为法国乃至欧洲的半导体产业升级提供关键技术支撑。
The French Alternative Energies and Atomic Energy Commission (CEA) has launched the NextGen project, a strategic initiative to design the next generations of FD-SOI (Fully Depleted Silicon-On-Insulator) semiconductor chips. The core objective is to develop more efficient and energy-efficient chips, ensuring France and Europe maintain control over advanced components and remain competitive in future microelectronics markets.
NextGen focuses on advancing FD-SOI technology, a specialty of European semiconductor research, known for its power efficiency advantages—a critical factor for applications like IoT, automotive, and edge computing. By spearheading this R&D effort, the CEA aims to secure technological sovereignty, reducing dependency on foreign chip designs and manufacturing processes. The project underscores a broader European push to bolster its semiconductor ecosystem amid global supply chain tensions and strategic competition.
En démarrant le projet NextGen, le CEA lance la conception de nouvelles générations de puces FD-SOI, plus efficientes et plus sobres énergétiquement. De quoi maîtriser les composants les plus avancés et assurer la compétitivité de la microélectronique française et européenne sur les marchés du futur.
The CEA has launched NextGen to design next-generation FD-SOI chips that are more efficient and energy-saving, aiming to keep French and European microelectronics competitive.
CEA — French public research organization, based in France.
Strongly track — this is a strategic semiconductor R&D move tied to Europe’s long-term chip competitiveness.