MEMS and Optomechanical Sensing in Focus at Upcoming 2026 Forums

The evolution of Microelectromechanical Systems (MEMS) from basic capacitive sensors in the 1980s to today's advanced piezoresistive sensors sets the stage for significant industry gatherings in 2026. These events will spotlight next-generation innovations in key areas like microphone MEMS and optomechanical sensing, driven by novel materials and sensing technologies.

The 17th MEMS Engineer Forum (MEF2026) will be held in Ryogoku, Tokyo, from April 21-22, 2026. Organized by engineers from leading industry players, this forum provides a comprehensive overview of MEMS as a core 21st-century technology and its projected development over the next decade. Since its inception in March 2009, MEF has convened a global community of engineers, technology managers, university researchers, consultants, and financiers. The goal is to foster open discussions between industry and academia to advance MEMS technology and contribute to the sustained growth of the worldwide MEMS industry. For more details, contact Pierre-Damien BERGER, MEMS Industrial Partnerships Manager, or visit the MEF website.

Concurrently, French research institute CEA-Leti is preparing a series of high-profile presentations on related microelectronics and photonics innovations across the globe:

* At the LID World Summit in Grenoble, France (June 23-25, 2026), over 1,250 semiconductor professionals will gather to explore recent advances.

* A strategic session at the Ambassador Hotel in Hsinchu, Taiwan, will feature CEA-Leti CEO Sébastien Dauvé alongside experts from CEA-Leti and Taiwan's ITRI. The agenda focuses on semiconductor innovation, covering Silicon Photonics, Advanced Heterogeneous Integration and Packaging, MicroLEDs, Power Management, and AI hardware architectures.

* CEA-Leti will also present its expertise in microelectronics reliability at IRPS 2026 in Beverly Hills, California.

* A dedicated event in Los Angeles, California, titled "Optical Interconnects: Driving Innovation in AI Factory and Beyond," will showcase CEA-Leti's cutting-edge technologies for datacenters and AI clusters. The institute's Optics and Photonics teams will present their latest results on optical data transmission using silicon photonics, µLEDs, and advanced packaging solutions.

From 4/21/2026 to 4/22/2026Ryogoku, Tokyo, Japan

The field of Microelectromechanical Systems (MEMS) has evolved significantly since the 1980s, transitioning from simple capacitive sensors to highly sensitive piezoresistive sensors. This presentation will outline the development roadmap for MEMS, emphasizing innovative materials and sensing technologies that are driving next-generation devices, particularly in microphone MEMS and optomechanical sensing.​

MEMS Industrial Partnerships Manager​​

The MEMS Engineer Forum (MEF) is a unique forum, organized by engineers among the key players in the field, aiming to provide an overview of the current state of MEMS technology, which is a core technology for the 21st century, and the future of the technology through the next decade.

​The 17th annual MEF2026 starting its debut in March 2009 brings together engineers from worldwide with their unique perspectives and skills in the basic MEMS technologies and other related areas to enhance a new stream both in business and technology development.

Participants include technology managers, university researchers, consultants, and financiers from around the world who are involved in MEMS technology development and business..We hope that open discussions among engineers and researchers from industry and academia was held at the MEF, and that by contributing to the enhancement and advancement of MEMS technology, we will make a further contribution to the lasting development of the MEMS industry worldwide.​

More information on ​​MEF’s website

4/21/2026to4/22/2026|​Ryogoku, Tokyo, Japan

Contact:  ​Pierre-Damien BERGER​​with any questions.​​

MEMS Industrial Partnerships Manager​​​

Event|Maison Minatec, Grenoble, France

LID World Summit from 23 to 25 June offer you a front-row seat to our most recent advances. Join more than 1,250 semiconductor industry professionals at this three-day global event and come away equipped and inspired to innovate!​

Event | Agenda|Ambassador Hotel, Hsinchu, Taiwan

Stay ahead in semiconductor innovation.

Join CEA-Leti CEO Sébastien Dauvé, together with CEA-Leti experts and ITRI leaders and specialists, for a strategic afternoon dedicated to semiconductor innovative technologies and high-level exchanges between French and Taiwanese innovation ecosystems. The program will address global industry outlook, and the latest advances in Silicon Photonics, Advanced Heterogeneous Integration and Packaging, MicroLEDs, Power Management strategies and AI-enabling hardware architectures.

CEA-Leti to Showcase Integrated Expertise In Microelectronics Reliability at IRPS 2026

Event | Agenda|Beverly Hills, CA 90210

Optical Interconnects: Driving Innovation in AI factory and Beyond​

Discover how CEA-Leti is transforming optical interconnects with cutting-edge technologies designed for datacenters and AI clusters.

Join us and meet our experts to learn how these innovations will boost your product development​.

Event | Agenda|Los Angeles, California, United States

DISCOVER CEA-LETI’S LATEST RESULTS IN SILICON PHOTONICS FOR OPTICAL INTERCONNECTS ​​

CEA-Leti's Optics and Photonics multidisciplinary teams introduced their latest results on optical data transmissions with silicon photonics, µLED & advanced packaging solutions.​