欧盟可持续数字与电子技术研讨会

EU Symposium for Sustainable Digital & Electronics Technology

CEA-Leti Original
摘要
2026年12月14至15日，法国CEA-Leti将在格勒诺布尔科学园举办全英文END研讨会，聚焦负责任数字领域的可持续软硬件集成方案。同期，该机构还将在LID全球峰会、PCIM及等离子刻蚀研讨会展示铁电存储器、氮化镓电源转换器与先进封装等创新，推动欧洲半导体技术主权与高价值产业应用。

2026年度可持续数字与电子技术欧盟研讨会（END*）将于12月14日至15日在法国格勒诺布尔科学园区举行。此次研讨会旨在推动信息与通信技术（ICT）领域更负责任的数字化发展，强调数据主权与材料、能源的掌控对于颠覆性数字元件及集成电路的可操作性与可持续性同等重要。研讨会将聚焦更可持续的集成硬件与软件解决方案，并发布相关宣言。

为扩大欧洲影响力，本届研讨会将从往届的法语专场改为全程英语进行。主办方指出，欧洲拥有推动数字领域以节俭、监管和伦理为基础发展所需的专业能力与技能，这一转型也将创造高质量就业岗位。

在同一场地的Minatec之家，还将同期举行一系列专业技术活动：

  • LID世界峰会（6月23日至25日）将汇聚超过1250名半导体行业专业人士，CEA-Leti将展示铁电存储器的最新成果，并围绕神经技术与低温CMOS电路进行两场专题报告。
  • PCIM活动将现场演示多项创新，包括基于压电储能的超薄电源转换器、采用飞跨电容拓扑的智能多电平变换器、用于燃料电池与电池电压适配的高功率多电平GaN DC/DC变换器，以及基于非侵入式传感器的电力电子预测性维护方案。焦点将放在CEA宽禁带技术路线图上，覆盖数据中心、无人机、汽车、航空、航天及医疗等多种应用场景。
  • 干法刻蚀与等离子体处理研讨会将汇集科学家、工程师和产业伙伴，讨论半导体、MEMS及新兴应用中的刻蚀与等离子体技术。CEA-Leti专家将在一号展位现场，分享六篇论文与海报，内容涉及生态创新、微凸块、扇出型晶圆级封装、先进封装及混合键合等。
Summary
CEA-Leti will present its latest technologies at multiple 2026 events, including the END symposium on sustainable ICT hardware and software, the LID World Summit with papers on ferroelectric memories and neurotechnologies, and PCIM featuring live demos of wide band gap power converters for applications from drones to data centers. The institute's experts will also discuss advances in dry etching and advanced packaging like hybrid bonding at a Grenoble workshop, underscoring Europe's push for a responsible, high-quality digital sector.

The EU Symposium for Sustainable Digital & Electronics Technology (END’26) will be held on December 14–15, 2026, at the Grenoble Scientific Polygon in France. The symposium focuses on fostering a more responsible digital sector—through frugality, regulation, and ethics—while generating high-quality jobs. It stresses that data mastery is as vital as materials and energy expertise for the operability and sustainability of next-generation digital components and integrated circuits. Discussions will target more sustainable integrated hardware and software for information and communication technologies (ICT). After French-language editions in 2024 and 2025, the 2026 event switches to English to broaden its European impact. A manifesto is available on the symposium’s website.

CEA-Leti researchers will also feature at several other events. At the LID World Summit (June 23–25), they will present a paper on ferroelectric memories and give two talks: one on neurotechnologies and another on cryo-CMOS circuits. At PCIM, live demonstrations will showcase an ultra-thin power converter based on piezoelectric storage, a smart multilevel converter using a flying capacitor topology, a high-power multilevel GaN DC-DC converter for adapting fuel cell to battery voltages, and predictive maintenance on power electronics via non-invasive sensors. The PCIM presence underlines CEA’s wide-bandgap semiconductor roadmap, addressing power-supply challenges in datacenters, drones, automotive, aeronautics, space, and medical applications.

Separately, at a workshop on dry etching, plasma processing, and related technologies for semiconductors, MEMS, and emerging applications, CEA-Leti experts will staff booth 1 and present six papers and posters covering eco-innovation, microbumps, fan-out wafer-level packaging (FO-WLP), advanced packaging, and hybrid bonding.

Résumé
Le CEA-Leti dévoile son agenda 2026 à Grenoble avec des événements majeurs, dont le symposium END* (14-15 décembre) sur les TIC durables et le LID World Summit (23-25 juin) réunissant plus de 1 250 professionnels des semi-conducteurs. L’institut présentera des avancées en mémoires ferroélectriques, neurotechnologies, circuits cryo-CMOS, ainsi que des convertisseurs GaN et des innovations en packaging, affirmant son leadership européen pour des composants plus frugaux et performants.

From 12/14/2026 to 12/15/2026Grenoble Scientific Polygon, France

Europe has the expertise and skills to promote a more responsible digital sector (frugality, regulation, ethics) that creates high-quality jobs. However, mastery of data is just as crucial as mastery of materials and energy when it comes to the operability and sustainability of disruptive digital components and integrated circuits. More sustainable integrated hardware and software solutions will be discussed at the END* symposium in the field of Information & Communication Technologies (ICT). >>Read our Manifesto here.

In 2026, the symposium will take place in Grenoble Scientific Polygon on December 14 and 15. To broaden its European reach, the symposium will be held in English, after 2024 & 2025 editon in French.​

More information on ​​END'26 website

12/14/2026to12/15/2026|​Grenoble Scientific Polygon, France

Event|Maison Minatec, Grenoble, France

LID World Summit from 23 to 25 June offer you a front-row seat to our most recent advances. Join more than 1,250 semiconductor industry professionals at this three-day global event and come away equipped and inspired to innovate!​

CEA-Leti will present a paper on Ferroelectric Memories have 2 presentations : on Neurotechnologies and Cryo-CMOS Circuits.

We’re excited to welcome you back to PCIM!

Join us to discover our latest innovations through live demonstrations, including:- Ultra thin power converter based on piezoelectric storage,- Smart multilevel converter utilizing flying capacitor topology- High Power multilevel GaN DCDC converter for fuel cell to battery voltages adaptation- Predictive maintenance on power electronic based on non invasive sensors.Focus will be put on CEA Wide Band Gap roadmap and technologies to address high demand and challenges on power supplies. It addresses different applications from data center to drones going through automotive, aeronautic, spatial, medical.

Event|Minatec, Grenoble, France

The workshop gathers scientists, engineers and industry partners to discuss advances and challenges in dry etching, plasma processing and related technologies for semiconductor, MEMS and emerging applications.

CEA-Leti experts will be onsite at booth 1 and available to discuss the findings of Six Papers and Posters Includes eco-innovation, microbumps, FO-WLP, packaging and hybrid bonding.

AI Insight
中文 EN
Core Point

The END'26 symposium in Grenoble will showcase European expertise in sustainable, frugal, and ethical ICT hardware/software, emphasizing data, materials, and energy mastery for disruptive components.

Key Players
  • CEA-Leti — French research institute specializing in microelectronics and nanotechnologies, based in Grenoble.
Industry Impact
  • ICT: High — Focus on sustainable digital infrastructure, hardware/software integration, and component design.
  • Energy: Medium — Power electronics advances (GaN, fuel cell converters, wide bandgap) for efficient energy conversion.
  • Automotive: Medium — Power supply innovations for electric vehicles and fuel cells.
  • Computing/AI: Low — Some relevance via neuromorphic and cryo-CMOS presentations, but not central.
Tracking

Monitor — The symposium targets European leadership in sustainable electronics, with CEA-Leti’s cross-industry demos potentially signaling future R&T directions.

Highlights
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半导体 科研
AI Processing
2026-06-29 16:21
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