CEA-Leti will host the workshop “plasma etch and strip processes for micro-, nano- and bio-technologies” at Minatec in Grenoble, France, from 8 to 9 June 2026. The event is designed as a meeting point for scientists, engineers and industry partners working on dry etching, plasma processing and adjacent technologies for semiconductors, MEMS and other emerging applications.

The agenda highlights a strong focus on advanced materials and integration challenges. On Monday 8 June, the program opens with a session on GeTe plasma etch process development for RF switch applications, followed by a keynote from Karim OHASSAN on advanced photonics platforms based on SOI, SiN and heterogeneous integration. Later that day, technical talks will cover HBr/H+ plasma etching of GeSe-GeTe chalcogenide films for integrated photonics, with attention to the morphology of blanket and patterned structures, as well as reactive ion etching of LiNbO3 waveguides and how fluorine-based gas chemistry affects morphology and etch rates.

On Tuesday 9 June, the program includes a presentation on investigating F plasmas for chamber cleaning efficiency and environmental sustainability in microelectronics, underscoring the workshop’s interest not only in process performance but also in cleaner, more sustainable manufacturing. The poster session on Monday evening adds several applied topics: the benefit of post-etch treatment for defectivity improvement in the BEOL, damage induced by ultraviolet photons from a Cl2/Ar plasma on N-polar n-GaN, plasma-surface interactions for direct bonding applications, and how gaseous effluent analysis can deepen understanding of plasma processes and support future developments.

The workshop is organized by Thierry Chevolleau, Patricia Pimenta-Barros and Nicolas Posseme, with contacts provided for questions. CEA-Leti positions the event as part of its broader activity in silicon photonic integration and related microfabrication technologies, and the announcement points readers to PESM’s website for more information.

From 6/8/2026 to 6/9/2026Minatec, Grenoble, France

The workshop gathers scientists, engineers and industry partners to discuss advances and challenges in dry etching, plasma processing and related technologies for semiconductor, MEMS and emerging applications.

Monday 8 June 202610:50 - 11:10 a.mSession 1Maison MINATEC

GeTe plasma etch process development for RF switch applications​

Monday 8 June 20261:00 - 1:30 p.mSession 2​Maison MINATEC

1st Author (keynote) : OHASSAN Karim

Advanced photonics platforms based on SOI, SiN, and heterogeneous integration

Monday 8 June 20262:10 - 2:30 p.mSession 2Maison MINATEC

HBr/H+ Plasma Etching of GeSe-GeTe Chalcogenide Films for Integrated Photonics: Morphology of Blanket and Patterned Structures

Monday 8 June 20262:30 - 2:50 p.mSession 2​Maison MINATEC

Reactive ion etching of LiNbO3 waveguides: Influence of fluorine-based gas chemistry on morphology and etch rates

Tuesday 9 June 2026​2:20 - 2:40 p.mSession 5​Maison MINATEC​

Investigating F Plasmas for Chamber Cleaning Efficiency and Environmental Sustainability in Microelectronics​

Monday 8 June 20265:40 - 7:00 p.mP01 - POSTER SESSION​Maison MINATEC​

Benefit of post etch treatment for defectivity improvement in the BEOL​​

Monday 8 June 20265:40 - 7:00 p.mP07 - POSTER SESSION​Maison MINATEC​

Study of damages induced by ultra-violet photons from a Cl2/Ar plasma on N-polar n-GaN​

Monday 8 June 20265:40 - 7:00 p.mP20 - POSTER SESSION​Maison MINATEC​

Study of plasma-surface interactions for direct bonding application​​

Monday 8 June 20265:40 - 7:00 p.mP21 - POSTER SESSION​​Maison MINATEC​

How gaseous effluent analysis enhances understanding of plasma processes and paves the way toward​

ORGANIZING ANDSCIENTIFIC COMMITTEE​REPRESENTATION​

Thierry CHEVOLLEAUPatricia PIMENTA-BARROS​Nicolas POSSEME

More information about ​Organizing and scientific commitee representation

Lab Director LIPS (Silicon Photonic Integration Laboratory)

ABOUT plasma etch and strip processes for micro-, nano- and bio-technologies

The workshop gathers scientists, engineers and industry partners to discuss advances and challenges in dry etching, plasma processing and related technologies for semiconductor, MEMS and emerging applications.

More information on ​PESM’s w​ebsite​​

From 6/8/2026 to 6/9/2026​ |​Minatec, Grenoble, France​

Contacts: ​​Thierry ChevolleauorPatricia Pimenta Barros​with any questions.​​

Electronics and Electrical Engineering Research Engineer

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