CEA-Leti Opens Access to Its LUMIK Technology for Prototyping Next-Generation Sensors
CEA-Leti 现已将其突破性的光机械传感技术通过 LUMIK 平台向外部开放，允许合作伙伴进行下一代传感器的原型开发。该技术将 MEMS（微机电系统）与硅光子学融合，性能远超传统传感器，尤其适用于便携式生物传感器、超高灵敏度质谱仪、原子力显微镜及高精度硅参考时钟等前沿应用。
合作伙伴可通过 CEA-Leti 的商业接口 CIME-P 网站提交设计，进入成本分摊的多项目晶圆（MPW）服务模式：一片晶圆被划分为若干区域，每个区域对应一个项目，所有参与方共享制造成本。加工完成后，晶圆被切割，各参与方仅收到自身设计的裸片，无法接触他人版图。首个制造批次的投片申请截止日期为 2026 年 11 月 20 日，所有设计将由 CEA-Leti 审核。
CEA-Leti 正与 CEA 及法国国家科学研究中心（CNRS）合作，重点推进该技术在生物传感器和原子力显微镜两大方向的发展，进一步巩固其在光机械传感领域的领先地位。
CEA-Leti has opened access to its LUMIK platform, allowing partners to prototype next-generation optomechanical sensors that merge MEMS with silicon photonics. This combination delivers performance far surpassing conventional MEMS sensors, targeting applications such as portable biosensors, ultra-sensitive mass spectrometers, atomic force microscopes (AFM), and high-accuracy silicon reference clocks.
Prototyping requests are submitted via the CIME-P website, CEA-Leti’s commercial partner, using a cost-effective Multi-Project Wafer (MPW) model. The manufactured wafer is partitioned into sections, each dedicated to a single partner’s design, so production costs are shared. After fabrication, the wafer is diced and each participant receives only their own chips, with no access to other designs. The deadline to join the first run is November 20, 2026.
CEA-Leti will review applications and continues to push the technology forward, particularly in biosensors and AFM, in collaboration with CEA and CNRS.
Optomechanical sensorscombine MEMS* technology with silicon photonics. This combination enables performance levels far beyond those of conventional sensors.
Optomechanical sensing is particularly well suited to applications such as portable biosensors, ultra-sensitive mass spectrometers, atomic force microscopes, and highly accurate silicon reference clocks.
This breakthrough technology, still emerging today, is now accessible through LUMIK, developed by CEA-Leti.
Partners can now prototype their own optomechanical sensors through LUMIK by submitting a request via theCIME-P website, CEA-Leti's commercial partner.
This new service provides cost-effective prototyping through a Multi-Project Wafer (MPW) approach. The manufactured wafer is divided into multiple sections, each dedicated to a partner's project, allowing production costs to be shared among participants.
Once fabrication is complete, the wafer is diced and each partner receives only its own chips, with no access to the designs of other participants.
Organizations interested in joining the first fabrication run have until November 20, 2026, to submit their sensor designs.
Applications will be reviewed by CEA-Leti, which continues to advance the technology through two major development areas: biosensors and atomic force microscopes, in collaboration with CEA and CNRS.
*MEMS :microelectromechanical systems
CEA-Leti launched LUMIK, a shared multi-project wafer service for prototyping optomechanical sensors that combine MEMS and silicon photonics, drastically lowering barriers for advanced sensor innovation.
Monitor — first fabrication run deadline (Nov 20, 2026) will gauge early commercial interest and application viability for optomechanical sensors.