Info Session on the Chips 2026 Call on 6G Front End Module (FEM)
Chips JU 即将于2026年7月7日启动“6G前端模块（FEM）”专项征集，欧盟投入预算约2000万欧元，旨在支持面向未来6G网络的先进前端模块技术研发与创新，助力欧洲巩固下一代连接领域的地位。该征集涵盖五大技术方向：AI原生通信、集成传感与通信（ISAC）、先进封装技术、异构集成，以及高可重构射频前端方案。项目提案截止日期为2026年9月16日。
为帮助潜在申请者了解征集目标与预期成果，并促进伙伴对接与合作探讨，AENEAS、EPoSS和INSIDE行业协会联合Chips JU办公室，将在征集启动前举办一场线上信息说明会。会议定于2026年7月2日中欧夏令时10:00至12:00举行，除介绍征集详情外，还将提供交流与联络机会，供与会者提前搭建合作网络，为提案提交做准备。
A virtual information session on the upcoming Chips Joint Undertaking (Chips JU) call for 6G Front End Module (FEM) technologies will take place on 2 July 2026 from 10:00 to 12:00 CEST, co-organised by industry associations AENEAS, EPoSS, and INSIDE together with the Chips JU Office. The event aims to help prospective applicants build consortia, exchange ideas, and prepare competitive proposals ahead of the call’s opening on 7 July 2026.
The call itself will allocate an indicative EU budget of €20 million to research and innovation projects targeting next-generation 6G radio front-end systems. Its thematic priorities span AI-native communications, Integrated Sensing and Communication (ISAC), advanced packaging, heterogeneous integration, and highly reconfigurable front-end architectures. The deadline for submissions is 16 September 2026. During the session, organisers will outline the call’s objectives and expected impacts, while also facilitating direct networking among participants to foster collaboration opportunities before the tight proposal window closes.
Are you interested in the upcoming Chips JU 6G Front End Module (FEM) Call and looking to connect with potential partners, explore project opportunities or prepare a competitive proposal? To support prospective participants ahead of the call launch AENEAS, EPoSS and INSIDE Industry Associatipons together with Chips JU Office are organising a dedicated online Information Session.
2 July 2026
10:00–12:00 CEST
ABOUT THE CALL
The Chips JU 6G Front End Module (FEM) Call, opening on 7 July 2026, will support research and innovation on advanced front-end module technologies for future 6G networks, helping Europe strengthen its position in next-generation connectivity.
Topics include:
• AI-native communications
• Integrated Sensing and Communication (ISAC)
• Advanced packaging technologies
• Heterogeneous integration
• Highly reconfigurable radio front-end solutions
Indicative EU budget: €20 million
Call opening: 7 July 2026
Proposal deadline: 16 September 2026
The Information Session will provide an overview of the call objectives and expected outcomes, while also offering participants the opportunity to network, exchange ideas and identify potential collaboration opportunities ahead of the proposal deadline.
More information and registration here.
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An info session on the upcoming Chips JU 2026 call for 6G front-end module research highlights EU investment to strengthen Europe’s position in next-gen connectivity semiconductors.
Monitor — info session previews a €20M call opening July 2026; monitor for consortia forming and proposal trends.